Failure Analysis

Advanced solutions for your product's life cycle

Delivering Materials Engineering analysis solutions in all phases of the product life cycle by leveraging our world class workforce, state-of-the-art laboratories and analytical tools to exceed customer’s expectations.

Technician in front of laptop, running the YXLON machine

Contact Us

Phone: 1-800-725-4787
E-mail:

analysis@raytheon.com

We support a wide range of industries, including defense, space, aerospace, electronics, automotive, satellite, and durable goods. With more than 60 years of experience in analytical engineering services, our labs will get you the right answer the first time. Our labs have a wide range of industry experts, as well as, leading-edge equipment and capabilities to handle specialized analyses.

The Raytheon Technologies Advantage

  • Our labs are staffed with 100 plus world class, highly-educated and certified engineers, scientists and technicians with hundreds of years of combined experience from a variety of disciplines, including electrical engineering, chemical engineering, mechanical engineering and physics.
  • Our facilities are located in Andover, MA; Tewksbury, MA; and Portsmouth, RI. With over 25,000 square feet of modern lab space and with more than 1,500 pieces of unique and complementary test equipment, we are full equipped to perform a wide range of chemical, electrical and mechanical tests.
  • Our central repository holds over 20 years of proven test and analysis results readily accessible which benefit your project. We've analyzed tens of thousands of components and assemblies.
  • Examples of specialized equipment: Computed Tomography and Real Time X-Ray, Field Emission Scanning Electron Microscope (FESEM), Electron Spectroscopy for Chemical Analysis (ESCA), Scanning Acoustic Microscopy, Fourier Transform Infrared Spectroscopy (FTIR), Dielectric Constant Equipment plus over 1,500 pieces of additional equipment.

The Materials Engineering Laboratories offers a full range of analysis services that bring value to any phase in the product life cycle, from initial design through production to field maintenance. Put our in-depth and state-of-the-art equipment to work for you. Our services include:

Failure Analysis

Failure Analysis
 

Determine the root case and recommend value-added solutions.  We work as your partner leveraging our vast experience in Failure Analysis.  Helping you quickly get to the root cause explanation of a component or material deficiency or process issue that may contribute to the problem.  This includes recommendations for corrective action and/or follow up with the manufacturer as appropriate.

Destructive Physical Analysis

Destructive Physical Analysis
 

Evaluate part construction to improve product reliability and detect counterfeit parts. In many cases, DPA is performed to MIL-STD-1580 using the test methods of:

Good cross section
  • MIL-STD-883
  • MIL-STD-750
  • MIL-STD-202

We can use our full range of analytical capabilities and areas of expertise to determine the exact construction, composition, and quality of almost any materials or components. Destructive analysis of a part can be used to identify its baseline construction and constituents, as well as to determine variations in the manufacturing process which may affect quality and reliability. Destructive analysis can be implemented as an on-going program to assess samples of incoming part lots prior to release in manufacturing. Supplier follow-up may be recommended.

Materials Analytical Methods

Materials Analytical Methods
 

NDT/NDE: Non-Destructive Test and Evaluation
Wide array of nondestructive analysis are available, including Computed Tomography (CT) Xray, Real Time X-Ray, ultrasonic and visual inspection using special lighting and polarization. Our experienced engineers can assist in the interpretation of NDT/NDE results, select appropriate methods and develop procedures that will assure the results obtained provide the maximum possible benefit for you.

Surface Analysis and Electron Microscopy
We support analysis of electronic components, especially semiconductor devices and assembled printed circuit boards. The laboratory also helps solve problems involving process development and engineering for a wide range of thin film and bulk materials: alloys, semiconductors, ceramics, composites, glasses, and polymers. Our Scanning Electron Microscopes / Energy Dispersive X-Ray (SEM/EDX) and Electron Spectroscopy for Chemical Analysis (ESCA) equipment are invaluable in identifying evidence of corrosion and contamination.

Chemical Analysis
Robust suite of analytical techniques used to evaluate and characterize the thermal, mechanical, and compositional properties of a wide range of parts and materials, including polymers, liquids, metals, ceramics, and composites.

Electrical
Die level to microcircuits to large electrical assemblies. Custom designed electrical analysis on your part types. Please see the test equipment list below for more information.

Mechanical Analysis
Analyzing microstructures with cross sectional analysis and spectroscopy techniques as well as characterization of localized and bulk mechanical properties.

Overall cross-sectional view. Suspect pin W2 (bottom) and adjacent functional pin W1 (top)

Design and Process Consultations

Design and Process Consultations
 

Your designers are experts in the proper function of your products. We know how and why your products can fail to function. These are fundamentally different and complementary skill sets. Our expert staff can help your design team understand the impact its design choices will have on reliability. This is important to ensure the final product is optimized for the needs of your customers.

Virtually any type of custom test program or problem investigation may be undertaken using our vast capabilities and resources. Investigations may combine multiple disciplines, including part analysis, test, materials, or physics. Please see the test equipment list below for more information.

Analysis Equipment Examples
 

The Failure Analysis and Materials Engineering Laboratories use state-of-the-art equipment and industry leading techniques to provide you with a wide range of product testing capabilities. These include:

Analytical Chemistry

Analytical Chemistry
 

  • Fourier Transform Infrared Analysis (FTIR) TGA-FTIR analysis
  • Liquid Chromatography (LC)
  • High Performance Liquid Chromatography
  • Gel Permeation Chromatography (GPC)
  • GPC interfaced to FTIR
  • Differential Scanning Calorimetry (DSC)
  • Dynamic Mechanical Analysis (DMA)
  • Tension, shear, torsion modes
  • Thermal Gravimetric Analysis (TGA)
  • Thermal Mechanical Analysis (TMA)
  • Differential Thermal Analysis (DTA)
  • Ion Chromatography
  • Arc Source Emission Spectroscopy
  • Inductively Coupled Plasma Emission Spectroscopy (ICP Emission Spectroscopy)
  • Combustion Analysis for Carbon and Sulfur in steels
  • Wet Chemical Analysis

Electrical

Electrical
 

  • Analog circuit analysis
  • Digital circuit analysis
  • Isolation of shorts, opens, and intermittent conditions
  • Passive component analysis
  • Semiconductor I/V and C/V parameter analysis
  • Real-time benchtop testing over temperature
  • Time-domain reflectometry (TDR)
  • Low to medium power testing
  • Hi-Pot testing
  • Insulation resistance
  • Surface resistance
  • Volume resistivity
  • Micro probing capabilities
  • RF analysis
  • Classified testing

Physical

Physical
 

  • Material characterization
  • Bond Pulling
  • Plasma Etcher
  • Construction Analysis (CA)
  • Destructive Physical Analysis (DPA)
  • Mechanical cross-sectioning
  • Precision measurement capabilities
  • Acoustic imaging
  • Real-time X-ray and Computed Tomography (CT)
  • Optical Microscopy
  • 3D imaging
  • Infrared thermography
  • Chemical de-processing
  • Laser de-capsulation

Specialty Test & Analysis Services

Specialty Test & Analysis Services
 

  • Drop impact evaluation
  • Counterfeit component analysis
  • Gross leak testing
  • Optical spectrum analysis
  • Thermal cycling
  • Humidity exposure
  • Wire Bonding
  • Bond pull and Ball Shear (Royce)
  • Laser milling (Control Laser Corp.)
  • Plasma Etching (Plasma Preen)
  • Jet Etching (Nisene)

Non-Destructive Analysis and Evaluation

Non-Destructive Analysis and Evaluation
 

  • Real-Time X-ray Radiography (RT X-Ray). Our real-time x-ray system is one of the most powerful available and has resolution of smaller than a millimeter and a chamber that can accommodate larger assemblies on a multi-axis stage.
  • Scanning Acoustic Microscopy, Acoustic Microscope Imaging (AMI, SAM) with high Frequency Capability
  • Dye Penetrant Testing
  • Eddy Current
  • Fiber Optic Examination/Borescope
  • Hermeticity Testing

Electron Microscopy and Surface Analysis

Electron Microscopy and Surface Analysis
 

  • SEM, ESCA, X-ray spectrometers, and various related systems
  • X-ray Photoelectron Spectroscopy
  • Small spot capability to 9 microns
  • Automated stage with Zalar rotation; chemical imaging
  • Ion gun for sputter depth profiles
  • Scanning Electron Microscopy/Energy Dispersive X-ray Spectroscopy (SEM, EDAX, XES)
  • Robinson Backscattered Electron Imaging (BSE)
  • Wavelength Dispersive X-ray Spectroscopy (WDS)
  • Integrated Energy and Wavelength Dispersive Spectroscopy
  • Field Emission Scanning Electron Microscopy/EDS (FESEM)
  • Wafer Analysis with Stored Stage Locations
  • Computer controlled FESEM/automated stage
  • Atomic Force Microscopy (AFM)
  • X-ray Diffraction (XRD) and X-ray Fluorescence (XRF)
  • Profilometry
  • Optical Interferometry

Materials Processing

Materials Processing
 

  • High Temperature Furnaces and Processing Equipment up to 1700 C
  • Inert Atmosphere and Vacuum Furnaces up to 2000 C
  • Chemical Vapor Decomposition (CVD)
  • Hot Isostatic Press (HIP)
    • Process Capabilities up to 2000 C @ 30,000 PSI
  • Flexus 230 stress Measurement System
  • Ellipsometer
  • Profilometer

Metallurgical Analysis

Metallurgical Analysis
 

  • Instron Mechanical Testing, Tensile testing with environmental chamber capabilities
  • Tension, shear, creep, flexure, low cycle fatigue, compression
  • Metallographic Preparation and Examination (Metallography)
  • Optical Microscopy
  • Strain Gauge Capabilities, Strain measurements
  • Fractography
  • Superficial Hardness Testers (Rockwell Hardness)