Technology Today

2015 Issue 1

Raytheon Advanced Manufacturing

Improving Product Prototyping and Manufacturing

Raytheon is leveraging innovations in manufacturing technology to enable affordable and reliable customer solutions. Our global team utilizes its Manufacturing Technology Network (MfgTN) and Technology Interest Groups (TIGs) along with a manufacturing Technology Area Director (TAD) to create a collaborative roadmap of manufacturing technology.

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Additional Features:

  • Raytheon Missile Facility Modernized by Advanced Technologies

    The Raytheon Redstone Missile Integration Facility (RRMIF) is a 55,000-square-foot manufacturing plant established in November of 2012 in Huntsville, Ala., for the production of Standard Missile-3 (SM-3) and Standard Missile-6 (SM-6) interceptors, key components to the U.S. Navy’s air and missile defense capability.

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  • Application of Robotics to the Assembly of Missile Seekers

    One of Raytheon’s key manufacturing strengths is its production of missile systems. Raytheon manufactures missiles for air, land, sea and space applications, including interceptors for U.S. ballistic missile defense. A key part of these missiles is the seeker, a device used to sense a target and guide the missile to the target location.

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  • Raytheon Advanced Products Center:
    RF Subsystem Manufacturing and Integration Excellence

    The Raytheon Advanced Products Center (APC) provides radio frequency (RF) technology design, development and manufacturing for the U.S. Department of Defense programs, producing key products for RF subsystems, including RF modules, micro-interconnect circuits, radomes, structural composites and antennas.

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  • Additive Manufacturing at Raytheon

    Many traditional part manufacturing processes are subtractive in nature where material is removed to create the final object. They typically require creation of new tools and fixtures which adds development cost and cycle time and ultimately drives how we design and build products. Additive Manufacturing (AM) is a term applied to a group of manufacturing processes that create objects by adding material, usually plastic or metal, in multiple thin layers where needed to form the final shape.

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  • Integrated Rapid Prototyping at Raytheon

    U.S. Department of Defense (DoD) customers require demonstration and evaluation of new product functionality and performance through prototypes, prior to a decision to proceed with the engineering and manufacturing development (EMD), i.e., prior to the DoD milestone B decision. According to a 2007 memorandum issued from the office of the Undersecretary of Defense, “Many troubled programs share the following common trait. Program decisions were based largely on paper proposals that provided inadequate knowledge of technical risk and a weak foundation for estimating development and procurement cost. Going forward, all acquisition strategies must include competitive prototyping before Milestone B.”

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  • Visual Immersion For Virtual Design and Manufacturing

    Raytheon is home to two Immersive Design Centers (IDCs), one in Tucson, Ariz., and the newest located in Andover, Mass. Each IDC features state-of-the-art CAVE Automatic Virtual Environment (CAVE) technology and is chartered to drive product excellence and accelerate time to market through use of immersive visualization and virtual reality solutions throughout the product life cycle.

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  • D-RAPCON 3D
    Virtual Prototyping Environment

    Creating a virtual three-dimensional (3D) environment to represent a proposed new system enables engineers and customers to visualize a finished product. Such a virtual environment was developed for the Deployable Radar Approach Control (D-RAPCON) system. D-RAPCON is Raytheon’s “air traffic control system in a box” and brings instant air traffic control to the battlefield or disaster site.

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  • Multilevel Wafer Stacking for 3D Circuit Integration

    Three-dimensional (3D) integration of advanced silicon and radio frequency (RF) devices enables simpler and more reliable systems at a significantly lower cost. Raytheon offers a suite of available wafer level packaging technologies and processes in this area, including:

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  • Raytheon University Partnerships Help Develop Advanced Manufacturing Technologies

    Advanced manufacturing by definition depends on the use of technology to improve processes, products and systems. Next-generation manufacturing technologies and concepts are being developed at universities throughout the world. Through multiple partnering efforts at leading universities, Raytheon is developing innovative manufacturing technologies that will be key enablers for current and future Raytheon systems.

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  • Vertically Integrated HgCdTe-based Sensor Manufacturing

    Mercury cadmium telluride (HgCdTe) is the most versatile and widely-used material for infrared (IR) sensors. Yet, no commercial vendor satisfies the defense industry’s needs for this material. Raytheon Vision Systems (RVS) has established a vertically-integrated capability for HgCdTe-based technology that begins with the raw materials and extends to the completed infrared (IR) focal plane array (FPA) sensor module, providing full end-to-end control of the process. In particular, the vertically integrated approach allows RVS to tailor the HgCdTe material characteristics for any specialized application, and it provides short-loop feedback in support of design innovation and material optimization.

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Mark E. Russel

A Message From Mark

Raytheon advanced manufacturing methods and processes are important elements of our technology development strategy. While much emphasis is placed on new component research and product designs, new manufacturing technologies also significantly improve the quality, reliability, timeliness and cost effectiveness of our products.

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  • Vice President

    Mark E. Russell


    Chief Technology Officer

    Bill Kiczuk


    Managing Editor

    Tony Pandiscio



    Senior Editors

    Tony Curreri
    Corey Daniels
    Tom Flynn
    Eve Hofert


    Art Director

    Susan DeCrosta


    Photography and Art

    Fran Brophy
    John DeAngelis
    Daniel Plumpton


    Website Design

    Nick Miller

    Publication Distribution

    Rose McGovern


    Contributors

    Paul Bailey
    Peter Kampf
    Steve Klepper
    Tony Marinilli
    Nora Tgavalekos

  • Office of Engineering, Technology and Mission Assurance

    Technology Today is published by the Office of Engineering, Technology and Mission Assurance