Raytheon offers a single reliable source for component-level electrical and environmental testing, radiation testing, failure analysis, and destructive or nondestructive physical testing and analysis for programs and projects of all sizes.
With state-of-the-art facilities and multidisciplined technical professionals, our component test and analysis labs serve a wide range of government and commercial clients.
Benefits of working with our team include:
- Comprehensive laboratory testing and related engineering consulting tailored to your specific needs
- Our research database, which makes 25 years of test and analysis experience readily available for the benefit of new projects
- Proven support for defense, space, aerospace, electronics, medical, automotive, satellite, and durable goods applications
Capabilities Overview
The Component Test and Analysis team specializes in electronic and mechanical components such as hybrids, connectors, cables, harnesses, passive or discrete components, and digital or linear devices. The test lab has extensive experience in developing test software to electrically and environmentally characterize virtually any integrated circuit, including analog, digital, mixed signal, converters, FPGA and ASICs, as well as experience in developing actual radiation environments for parts testing. The component analysis team offers the analytical expertise and advanced instrumentation to identify root cause explanation for a wide range of component-level failures, as well as the resources to evaluate for possible quality and reliability issues through non-destructive and destructive techniques. With access to a detailed database, the Component Test and Analysis team offers a 25-year history of test and analysis data — a valuable resource for addressing new customer requirements.
Component Evaluation and Test Lab – A full-service facility that evaluates and tests components for commercial, airborne, military, space and other applications. Capabilities include: testing for design verification, component characterization, upgrade, screening, qualification and environmental factors. Other special services: radiation characterization and lot acceptance testing, latch-up, single event upset, and neutron testing.
Component Failure Analysis and Destructive Physical Analysis Lab – A full-service facility that provides analytical expertise and tools necessary to determine root-cause explanation for any electrical, mechanical, or material issues related to component failures. The lab also performs destructive analyses to ascertain the compliance of a manufacturer’s process and workmanship, and to ensure that high reliability components are fabricated to the required standards. Additional tests and analysis capabilities are processed as technical service requests.
Component Evaluation and Test
Electrical Testing
Digital, linear, ASICs
Wafer probing
Semiconductors
RF and microwave
Passive and magnetics
Opto-electronics
Radiation Testing
Total dose gamma
Neutron
Dose rate
Single event environments
Environmental Testing
Burn-in
Temperature cycling
Humidity
Constant acceleration
Data acquisition
Highly accelerated stress test (HAST)
Thermal shock
Certification
DSCC lab per MIL-STD-750 and MIL-PRF-19500
Component Failure Analysis and Destructive Physical Analysis
Imaging
Radiography (real-time and computed tomography (CT))
Infrared thermography (hot spot detection)
Infrared thermal mapping
Photoemission microscopy
Scanning electron microscopy (SEM)
Energy dispersive X-ray analysis
C-mode scanning acoustic microscopy (C-SAM)
Destructive
Cross-sectional and metallographic analysis
Chemical decapsulation/depotting
Mechanical delidding
Particle retrieval and analysis
Dye penetrant examination
Dimensional measurements
Photomicrography
Die/ball/bump shear, bond pull
Special Capabilities
Counterfeit components identification
Prohibited materials testing (in-house or off-site)
Materials analysis
Construction analysis
Fractography
Semiconductor (die-level) microprobing
Particle impact noise detection (PIND)
Hermetic seal testing (fine and gross)
Lot evaluation (LAT, freshness, screening)
Microhardness testing (Vickers, Knoop)
Hardness testing (Rockwell)
Solderability testing
Certification
NAS 410 Level II in radiographic testing (RT), ultrasonic testing (UT), penetrant testing (PT)
AS9100
OSHA VPP


