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Raytheon offers a single reliable source for component-level electrical and environmental testing, radiation testing, failure analysis, and destructive or nondestructive physical testing and analysis for programs and projects of all sizes.

With state-of-the-art facilities and multidisciplined technical professionals, our component test and analysis labs serve a wide range of government and commercial clients.

Benefits of working with our team include:

  • Comprehensive laboratory testing and related engineering consulting tailored to your specific needs
  • Our research database, which makes 25 years of test and analysis experience readily available for the benefit of new projects
  • Proven support for defense, space, aerospace, electronics, medical, automotive, satellite, and durable goods applications

Capabilities Overview

The Component Test and Analysis team specializes in electronic and mechanical components such as hybrids, connectors, cables, harnesses, passive or discrete components, and digital or linear devices. The test lab has extensive experience in developing test software to electrically and environmentally characterize virtually any integrated circuit, including analog, digital, mixed signal, converters, FPGA and ASICs, as well as experience in developing actual radiation environments for parts testing. The component analysis team offers the analytical expertise and advanced instrumentation to identify root cause explanation for a wide range of component-level failures, as well as the resources to evaluate for possible quality and reliability issues through non-destructive and destructive techniques. With access to a detailed database, the Component Test and Analysis team offers a 25-year history of test and analysis data — a valuable resource for addressing new customer requirements.

Component Evaluation and Test Lab – A full-service facility that evaluates and tests components for commercial, airborne, military, space and other applications. Capabilities include: testing for design verification, component characterization, upgrade, screening, qualification and environmental factors. Other special services: radiation characterization and lot acceptance testing, latch-up, single event upset, and neutron testing.

Component Failure Analysis and Destructive Physical Analysis Lab – A full-service facility that provides analytical expertise and tools necessary to determine root-cause explanation for any electrical, mechanical, or material issues related to component failures. The lab also performs destructive analyses to ascertain the compliance of a manufacturer’s process and workmanship, and to ensure that high reliability components are fabricated to the required standards. Additional tests and analysis capabilities are processed as technical service requests.

Component Evaluation and Test

Electrical Testing

Digital, linear, ASICs

Wafer probing


RF and microwave

Passive and magnetics


Radiation Testing

Total dose gamma


Dose rate

Single event environments

Environmental Testing


Temperature cycling


Constant acceleration

Data acquisition

Highly accelerated stress test (HAST)

Thermal shock


DSCC lab per MIL-STD-750 and MIL-PRF-19500

Component Failure Analysis and Destructive Physical Analysis


Radiography (real-time and computed tomography (CT))

Infrared thermography (hot spot detection)

Infrared thermal mapping

Photoemission microscopy

Scanning electron microscopy (SEM)

Energy dispersive X-ray analysis

C-mode scanning acoustic microscopy (C-SAM)


Cross-sectional and metallographic analysis

Chemical decapsulation/depotting

Mechanical delidding

Particle retrieval and analysis

Dye penetrant examination

Dimensional measurements


Die/ball/bump shear, bond pull

Special Capabilities

Counterfeit components identification

Prohibited materials testing (in-house or off-site)

Materials analysis

Construction analysis


Semiconductor (die-level) microprobing

Particle impact noise detection (PIND)

Hermetic seal testing (fine and gross)

Lot evaluation (LAT, freshness, screening)

Microhardness testing (Vickers, Knoop)

Hardness testing (Rockwell)

Solderability testing


NAS 410 Level II in radiographic testing (RT), ultrasonic testing (UT), penetrant testing (PT)




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