Highlights

IR Wall Chart (for hardcopy, send request to contact below. Include name, email address, mailing address, phone number and company)

Facilities
Raytheon Vision Systems utilizes the 350,000 square feet of state of the art facilities to produce the products used by both the United States Military and International forces, Commercial and Strategic Space Based platforms, and airborne and ground platforms. RVS produces products that range from the visible to the long wave infrared, all with the goal of customer satisfaction and complete mission assurance.

Molecular Beam Epitaxy (MBE)
Molecular Beam Epitaxy (MBE) is a crystal growth technique used to produce multilayer HgCdTe infrared detector structures. In the MBE process these structures are deposited under ultra-high vacuum (UHV) conditions by the controlled evaporation of the constituent materials which are Hg, Cd, and Te and dopant atoms. The ratios at which each of these materials are evaporated onto a substrate of either CdZnTe or Si is used to controllable determine the wavelength at which the HgCdTe detector will respond to (cutoff wavelength). Using this process the cutoff wavelength can be varied anywhere from short, or SWIR (1-3 µm), to very long, or VLWIR (12-14 µm). This process is used to produce materials for state-of-the-art single-color, two-color, large format, and avalanche photodiode focal plane arrays (FPAs).

Development and Production
Raytheon Vision Systems (RVS) develops and produces a broad range of vision components, covering multiple spectrums. Vertical integration at RVS incorporates material growth, semiconductor processing, and packaging. RVS provides capabilities ranging from single unit development of custom modules to high rate, low cost production.

Readout Design
As Visible and Infrared Focal Plane Arrays (FPAs) become more complex, Readout Integrated Circuits (ROICs) have emerged as a major discriminator in system performance. Early ROICs were simple multiplexers that performed little – if any – signal processing on the detector diode signal. Advances in silicon fabrication processes for analog and digital integrated circuits have opened a new era in visible and IR FPAs where digital signal processing can be achieved on the focal plane. Significant advances in the area of mixed-mode ROIC designs have enabled greater functionality and performance of the sensor chip assembly. Fabricated designs have demonstrated such features as subframe averaging, spatial filtering, temporal filtering, random transient event suppression, motion detection, and edge enhancement on the readout. These ROICs help to meet the increasing demand for more on-chip signal processing, which enhances system performance and can ease requirements and reduce the cost of downstream components.

Electronics Design
The RVS Electronics department provides a turnkey solution for all your camera needs. From conceptual design to production support, RVS Electronics has the skill and expertise to interface to any Sensor Chip Arrays (SCAs), ROICs, cooling systems, and your unique system interfaces - whether that is Cameralink, Front Panel Data Port, USB, or a custom I/O. RVS Electronics has developed key image processing IP allowing for rapid development of systems for your applications, including dead pixel replacement, fixed and Scene Based Non-uniformity correction, motion detection, and optical correction. We can provide off the shelf solutions or custom electronics to meet any of your demanding environmental requirements.

Raytheon Vision Systems - Capabilities

Highlights